In chip lithography processes, this substance is often used as a photoresist adhesion promoter. It can be sprayed on the surface of the silicon wafer through liquid phase or gas phase to modify the surface of the silicon wafer to change its surface property from hydrophilic to hydrophobic. On the one hand, this can enhance the adhesion between the photoresist and the silicon wafer, ensuring that the photoresist can be firmly attached to the silicon wafer during the subsequent photolithography process, ensuring the accuracy and stability of the photolithography pattern; on the other hand, it can inhibit the intrusion of etching liquid and effectively improve the corrosion resistance, which is of great significance for improving the manufacturing quality and yield rate of chips.